Advanced Three-Dimensional Microelectrode Architecture Design for High-Performance On-Chip Micro-Supercapacitors
Panpan Zhang, Sheng Yang, Honggui Xie, Yang Li, Faxing Wang, Mingming Gao, Kun Guo*, Renheng Wang*, and Xing Lu*
ACS Nano 2022
https://doi.org/10.1021/acsnano.2c07609
Abstract
The rapid development of miniaturized electronic devices has greatly stimulated the endless pursuit of high-performance on-chip micro-supercapacitors (MSCs) delivering both high energy and power densities. To this end, an advanced three-dimensional (3D) microelectrode architecture design offers enormous opportunities due to high mass loading of active materials, large specific surface areas, fast ion diffusion kinetics, and short electron transport pathways. In this review, we summarize the recent advances in the rational design of 3D architectured microelectrodes including 3D dense microelectrodes, 3D nanoporous microelectrodes, and 3D macroporous microelectrodes. Furthermore, the emergent microfabrication strategies are discussed in detail in terms of charge storage mechanisms and structure–performance correlation for on-chip MSCs. Finally, we conclude with a perspective on future opportunities and challenges in this thriving field.
